Circuitized substrate with electronic components mounted on transversal portion thereof

ABSTRACT

A circuitized substrate for mounting at least one electronic component having a plurality of terminals. The circuitized substrate includes a first portion of electrical insulating material embedding a first electric circuit for coupling a first subset of the terminals. The first electric circuit including one or more patterned conductive layers of electrically conductive material extending parallel to a plane of the circuitized substrate. The circuitized substrate further includes a second portion of electrically conductive material. One or more insulating elements of electrical insulating material cross the second portion transversally to the plane to insulate a plurality of conductive elements thereof for coupling a second subset of the terminals. One or more auxiliary components of the electronic component are mounted on the second portion. Each auxiliary component having a first terminal and a second terminal coupled with a first one and a second one, respectively, of a pair of the conductive elements.

PRIOR FOREIGN APPLICATION

This application claims priority from Italian patent application number102016000068268, filed Jun. 30, 2016, which is hereby incorporatedherein by reference in its entirety.

BACKGROUND

The background is hereinafter introduced with the discussion oftechniques relating to its context. However, even when this discussionrefers to documents, acts, artifacts and the like, it does not suggestor represent that the discussed techniques are part of the prior art orare common general knowledge in the field relevant to aspects of thepresent disclosure.

Aspects of the present disclosure relate to the field of electronics.More specifically, aspects of the disclosure relate to circuitizedsubstrates.

Circuitized substrates (i.e., insulating substrates supporting electriccircuits) are commonly used in electronic devices to mount electroniccomponents thereof (so as to protect them from mechanical stresses andto connect them electrically). A typical example is a chip carrier thatmounts a (monolithic) chip implementing an Integrated Circuit (IC). Forexample, the corresponding electronic device may be of the flip-chiptype, also known as Controlled Collapse Chip Connection (C4); in thiscase, the chip is flipped and its terminals are directly connected tofacing lands of the carrier, which are generally connected to contacts(for example, balls) of the electronic device arranged on an oppositesurface of the carrier by through via-holes, or simply through vias.

Operation of the integrated circuit of the chip often requires one ormore auxiliary components. For example, decoupling capacitors (de-caps)are associated with supply terminals of the chip (used to provide apower supply thereto) to reduce undesired noise in the power supply. Forthis purpose, the (decoupling) capacitors are arranged between thesupply terminals receiving a ground voltage and the supply terminalsreceiving a supply voltage. In this way, the capacitors may shunt (AC)signals superimposed on the (DC) power supply and fluctuations in thepower supply caused by switching occurring in the integrated circuit;moreover, the capacitors may store energy to compensate short drops ofthe power supply due to changing current demand of the integratedcircuit.

The capacitors may be integrated on the chip itself. However, specialtechnologies are required to insulate the capacitors from the rest ofthe integrated circuit (for example, in deep trench structures); thesespecial technologies increase the cost of the chip (and then of thewhole electronic device) and they may not be always available. Moreover,the capacitors that may be integrated on the chip are small and thenwith low capacitance. In any case, this has a significant impact on themanufacturing of the chip; indeed, the integration of the capacitors onthe chip requires a dedicated development thereof, with correspondingdesign, test and deployment.

Alternatively, the capacitors may be mounted on the carrier. However,the limited room available to mount the capacitors only allows the useof relatively small capacitors and then again with low capacitance.Moreover, the connections of the capacitors to the chip may create abottleneck for the required current density. In any case, the relativelyhigh distance between the chip and the capacitors degrades performance;indeed, the corresponding connections introduce a significantly highline inductance and series resistance.

In both cases, the (relatively) low capacitance that is provided maycause unacceptable variations of the power supply.

Moreover, a complete re-qualification is required for each type of chipand/or for new generations thereof.

An interposer may also be provided between the carrier and the chip tomount the capacitors. However, this significantly increases the size ofthe electronic device. In any case, the interposer has a detrimentaleffect on the cost of the electronic device.

SUMMARY

Shortcomings of the prior art are overcome and additional advantages areprovided through the provision of a circuitized substrate for mountingat least one electronic component having a plurality of terminals. Thecircuitized substrate includes a first portion of electrical insulatingmaterial embedding a first electric circuit for coupling a first subsetof terminals, the first electric circuit including one or more patternedconductive layers of electrically conductive material extending parallelto a plane of the circuitized substrate; a second portion ofelectrically conductive material, where one or more insulating elementsof electrical insulating material cross the second portion transversallyto the plane to insulate a plurality of conductive elements thereof forcoupling a second subset of terminals; and one or more auxiliarycomponents of an electronic component mounted on the second portion, anauxiliary component having a first terminal and a second terminalcoupled with a first conductive element and a second conductive element,respectively, of a pair of conductive elements of the plurality ofconductive elements.

Methods and devices relating to one or more aspects are also describedand claimed herein.

Additional features and advantages are realized through the techniquesdescribed herein. Other embodiments and aspects are described in detailherein and are considered a part of the claimed aspects.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure, as well as further features andadvantages thereof, will best be understood with reference to thefollowing detailed description thereof, given purely by way of anon-restrictive indication, to be read in conjunction with theaccompanying drawings (wherein, for the sake of simplicity,corresponding elements are denoted with equal or similar references andtheir explanation is not repeated, and the name of each entity isgenerally used to denote both its type and its attributes—such as value,content and representation). In this respect, it is expressly intendedthat the figures are not necessary drawn to scale (with some detailsthat may be exaggerated and/or simplified) and that, unless otherwiseindicated, they are merely used to illustrate the structures andprocedures described herein conceptually. Particularly:

FIG. 1 shows a schematic representation in cross-sectional side view ofan electronic device wherein an aspect according to an embodiment of thepresent disclosure may be applied;

FIG. 2 shows a schematic representation in side view of an example of asupply insert of the electronic device according to an embodiment of thepresent disclosure;

FIG. 3-FIG. 5 show an illustrative representation in perspective view ofthe supply insert according to different embodiments of the presentdisclosure;

FIG. 6 shows an illustrative representation in perspective view of thesupply insert according to an embodiment of the present disclosure;

FIG. 7A-FIG. 7D show phases of a process for manufacturing the supplyinsert according to an embodiment of the present disclosure; and

FIG. 8 shows phases of a process for manufacturing the supply insertaccording to an embodiment of the present disclosure.

DETAILED DESCRIPTION

With reference to FIG. 1, a schematic representation in cross-sectionalside view is shown of an electronic device 100 wherein an aspectaccording to an embodiment of the present disclosure may be applied.

In one example, the electronic device 100 is of the flip-chip type,wherein a chip 105 is flipped and then directly connected to a (chip)carrier 110.

The chip 105 comprises a die 115 of semiconductor material (for example,silicon), whereon a circuit implementing an electronic component (forexample, a microprocessor) is integrated. Terminals of electricallyconductive material (for example, pads of copper) are exposed on a(front) surface of the die 115 (typically covered with a protectivelayer of electrically insulating material, such as silicon oxide). Theterminals are used to access the integrated circuit of the chip 105;e.g., some (signal) terminals, denoted with reference 120 s, are used toexchange signals (i.e., input/output electrical quantities processed bythe integrated circuit according to its function) and some (supply)terminals, denoted with reference 120 p, are used to receive a powersupply of the chip 105 (i.e., a reference voltage, or ground, and asupply voltage with reference thereto). Generally, the terminals 120 s,120 p are arranged in a grid (for example, with up to some thousands ofterminals 120 s, 120 p arranged in rows and columns); the supplyterminals 120 p (for example, more than a half of all the terminals) aremore densely concentrated in a central portion of the grid, organized incorresponding (partial) rows for receiving the ground voltage and thesupply voltage alternately.

The carrier 110 comprises a circuitized substrate 125; the circuitizedsubstrate 125 extends between a front surface 125 f and a back surface125 b opposite to each other, which define the orientation of a mainplane of the circuitized substrate 125 (parallel thereto).

The circuitized substrate 125 has a main portion 130 of electricallyinsulating material (for example, epoxy resin), which provides themechanical characteristics of the circuitized substrate 125; the mainportion 130 extends between an end surface 130 f and an end surface 130b, parallel to the main plane of the circuitized substrate 125. The mainportion 130 embeds a signal (electric) circuit 135 ms. The signalcircuit 135 ms comprises one or more conductive layers of electricallyconductive material (for example, copper), which extend parallel to themain plane of the circuitized substrate 125 (for example, with asandwiched structure formed by a rigid core and alternated conductivelayers and insulating layers); the conductive layers are patterned intotraces, with the traces in the different conductive layers that areconnected among them by through-vias (crossing the insulating layers).

A through-hole 145 crosses the main portion 130 from the end surface 130f to the end surface 130 b; the through hole 145 is formed in a centralarea of the circuitized substrate 125, in the shadow region (under thechip 105) encompassing the core shadow region (under the supplyterminals 120 p). A supply module 150 of electrically conductivematerial (for example, copper) is inserted in the through hole 145; thesupply module 150 extends between a front surface 150 f and a backsurface 150 b that are flush with the end surface 130 f and the endsurface 130 b, respectively, of the main portion 130. One or moreinsulating elements 155 of electrically insulating material (forexample, epoxy resin) cross the supply insert 150, transversally to themain plane of the circuitized substrate 125. The insulating elements 155insulate a plurality of conductive elements 160 of the supply module150, which extend transversally to the main plane of the circuitizedsubstrate 125 as well (for example, along the rows of the supplyterminals 120 p), so as to obtain a sandwiched structure (in vertical)formed by alternated insulating elements 155 and conductive elements160.

The circuitized substrate 125 further has a (front) external portion 165f of electrically insulating material, which covers the end surface 130f and the supply module 150 (above) to define the front surface 125 f,and a (back) external portion 165 b of electrically insulating material,which covers the end surface 130 b and the supply module 150 (below) todefine the back surface 125 b (for example, both of the same material ofthe main portion 130). The external portion 165 f and the externalportion 165 b embed a (front) signal (electric) circuit 170 fs and a(back) signal (electric) circuit 170 bs, respectively (around the coreshadow region of the chip 105) and a (front) supply (electric) circuit170 fp and a (back) supply (electric) circuit 170 bp, respectively (inthe core shadow region of the chip 105); the signal circuits 170 fs, 170bs are (electrically) coupled with the signal circuit 135 ms and thesupply circuits 170 fp, 170 bp are (electrically) coupled with theconductive elements 160 (for example, by the use of through-vias). Asabove, the (signal/power) circuits 170 fs, 170 fp and the (signal/power)circuits 170 bs, 170 bp comprise one or more corresponding conductivelayers of electrically conductive material (for example, copper), whichextend parallel to the main plane of the circuitized substrate 125 (forexample, again with a sandwiched structure formed by alternatedconductive layers and insulating layers); the conductive layers arepatterned into traces, with the traces in the different conductivelayers that are connected among them by through-vias (crossing theinsulating layers).

The signal circuit 170 fs and the supply circuit 170 fp expose contactelements of electrically conductive material (for example, lands ofcopper) on the front surface 125 f, which are (electrically andmechanically) coupled (for example, by solder bumps) with the signalterminals 120 s and with the supply terminals 120 p, respectively (witha filler of electrically insulating material that fills a space betweenthe die 115 and the circuitized substrate 125 to improve theirmechanical connection and compensate their different thermal expansioncoefficient); in this way, the supply circuit 170 fp may compensate anydifference in the arrangement of the supply terminals 120 s and of theconductive elements 160. On the other hand, the signal circuit 170 bsand the supply circuit 170 bp expose contact elements of electricallyconductive material (for example, lands of copper) on the back surface125 b, which are (electrically and mechanically) coupled with signalcontacts 175 s and with supply contacts 175 p, respectively, of theelectronic device 100 (for example, balls of electrically conductivematerial arranged in a grid when of the BGA (ball grid array) type); inthis case as well, the supply circuit 170 bp may compensate anydifference in the arrangement of the supply contacts 175 s and of theconductive elements 160. The whole assembly is generally embedded in acase of electrically insulating material that protects the chip 105 fromthe external environment, for example, by fastening a lid 180 onto thefront surface 125 f (around the chip 105).

With reference now to FIG. 2, a schematic representation in side view isshown of an example of a supply insert 200 of the electronic deviceaccording to an embodiment of the present disclosure.

The supply insert 200 comprises the above-described supply module 150(with the conductive elements 160 separated by the insulating elements155), to be inserted in the corresponding through-hole in the mainportion of the circuitized substrate (not shown in the figure).

In an aspect according to an embodiment of the present disclosure, oneor more auxiliary components of the integrated circuit of the chip (notshown in the figure) are mounted on the supply module 150; for example,these auxiliary components are (decoupling) capacitors 205 (only oneshown in the figure), such as of MultiLayer Ceramics (MLC) type. As anexample, each capacitor 205 bridges over an insulating element 155 (ormore); more specifically, the capacitor 205 has a (first) terminal 205 aand a (second) terminal 205 b, which are (electrically and mechanically)coupled with a pair of (adjacent) conductive elements 160, separated bythe insulating element 155.

In the above-described aspect, the capacitors 205 are provided outsidethe chip (so as to avoid the use of special technologies for theirintegration).

Nevertheless, the coupling of the capacitors 205 with the conductiveelements 160 of the supply insert 200 avoids (or at least substantiallymitigates) any bottleneck for the required current density.

Moreover, the capacitors 205 are arranged very close to the supplyterminals of the chip; this provides good performance (since thecorresponding connections have low line inductance and seriesresistance).

This aspect allows obtaining a relatively high density of the capacitors205 and then a corresponding high capacitance (for example, up toseveral hundreds of μF), which provides a significant reduction in thevariations of the power supply.

The same supply insert may be used for different types of chip;moreover, the supply insert may remain valid over time (for example, forseveral generations of the same chip), since the characteristics of thecapacitors 205 are generally quite stable.

The above-described aspect is very flexible. Indeed, differentcapacitors 205 with different high-frequency characteristics, forexample, either of a standard type or of a low Equivalent SeriesResistance (ESR) type, may be combined in different ways to providedifferent frequency responses.

With reference now to FIG. 3-FIG. 5, an illustrative representation inperspective view is shown of the supply insert 200 according todifferent embodiments of the present disclosure.

In all these cases, recesses are formed in the supply module 150 forhousing the capacitors 205. For example, each recess is formed along acorresponding insulating element 155; the recess extends within theadjacent conductive elements 160 that are separated by this insulatingelement 155.

For example, starting from FIG. 3, the recesses are channels that extendin the supply module 150 from one or more of its (end) surfaces that arereached by the insulating elements 155; for example, channels 305 f areformed at the (hosting) front surface 150 f and channels 305 b areformed at the (hosting) back surface 150 b of the supply module 150 (bycorresponding grooves that cross the supply module 150 for its wholewidth). In this case, a channel 305 f and a channel 305 b is formedalong each insulating element 155. As a result, a raised portion 310 fof the front surface 150 f is defined between each pair of adjacentchannels 305 f (and at the side of the first one and of the last one ofthe channels 305 f) and a raised portion 310 b of the back surface 150 bis defined between each pair of adjacent channels 305 b (and at the sideof the first one and of the last one of the channels 305 b), runningalong the rows of the supply terminals of the chip (not shown in thefigure); in this case, the raised portions 310 f and the raised portions310 b are aligned to each other, and all the raised portions 310 f, 310b are free of the insulating elements 155. Several capacitors 205 arehoused within each channel 305 f, 305 b (for example, distributeduniformly along it). Moreover, the front supply circuit and the backsupply circuit (not shown in the figure) are coupled with the conductiveelements 160 at the front surface 150 f and at the back surface 150 b,respectively, by through-vias 315 f and by through-vias 315 b,respectively, that contact the raised portions 310 f and the raisedportions 310 b, respectively (for example, at several contact positionsdistributed uniformly along them).

In this way, assuming that the conductive elements 160 alternatelyreceive the supply voltage (Vdd) and the ground voltage (GND), thecapacitors 205 are connected in parallel to the corresponding supplyterminals of the chip (not shown in the figure), so as to provide atotal capacitance equal to the sum of their capacitances. Theabove-described configuration obtains a good density of the capacitors205 that provides a good total capacitance, for example, of the order of2×50-100 capacitors per cm2 (with capacitors 205 of 0.6 mm length, 0.3mm width and 0.3 mm thickness); at the same time, the raised portions310 f, 310 b (for example, with a width of 0.2-0.6 mm) provide a robustcoupling with the conductive elements 160.

Moving to FIG. 4, as above the recesses are channels that extend in thesupply module 150 from one or more of its (end) surfaces that arereached by the insulating elements 155, for example, channels 405 fformed at the (hosting) front surface 150 f and channels 405 b formed atthe (hosting) back surface 150 b of the supply module 150. However, inthis case the channels 405 f and 405 b are formed alternately along theinsulating elements 160. As above, a raised portion 410 f of the frontsurface 150 f is defined between each pair of adjacent channels 405 f(and at the side of the first one and of the last one of the channels405 f) and a raised portion 410 b of the back surface 150 b is definedbetween each pair of adjacent channels 405 b (and at the side of thefirst one and of the last one of the channels 405 f), running along therows of the supply terminals of the chip (not shown in the figure); inthis case, the raised portions 410 f and the raised portions 410 b arestaggered to each other, and each raised portion 410 f, 410 b (apartfrom the first ones and the last ones) has an insulating element 155that extends from it. As above, several capacitors 205 are housed withineach channel 405 f, 405 b (for example, distributed uniformly along it).Moreover, the front supply circuit and the back supply circuit (notshown in the figure) are coupled with the conductive elements 160 at thefront surface 150 f and at the back surface 150 b, respectively, bythrough-vias 415 f and by through-vias 415 b, respectively, that contactthe raised portions 410 f and the raised portions 410 b, respectively;however, in this case, the through-vias 415 f, 415 b along each raisedportion 410 f, 410 b contact each one of the corresponding adjacentconductive elements 160 at several contact positions (for example,distributed uniformly along them) that are staggered to each other; thisavoids (or at least significantly reduces) any risk of interferenceamong the through-vias 415 f, 415 b of adjacent conductive elements 160.

As above, the capacitors 205 are connected in parallel to thecorresponding supply terminals of the chip (not shown in the figure), soas to provide a total capacitance equal to the sum of theircapacitances. The above-described configuration obtains a high densityof the capacitors 205 that provides a high total capacitance, forexample, of the order of 2×150-250 capacitors (as above) per cm2.

Moving to FIG. 5, in this case the recesses are through-holes 505 thatcross the supply module 150 (shown in partially cut away view in thefigure); for example, several through-holes 505 are formed along eachinsulating element 155. As above, several capacitors 205 are housedwithin each through-hole 505 (for example, distributed uniformly alongit). Moreover, the front supply circuit and the back supply circuit (notshown in the figure) are coupled with the conductive elements at thefront surface and at the back surface by respective through-vias thatcontact them, only visible at the front surface 150 f and denoted withthe reference 515 f in the figure (for example, at several contactpositions distributed uniformly along them).

As above, the capacitors 205 are connected in parallel to thecorresponding supply terminals of the chip (not shown in the figure), soas to provide a total capacitance equal to the sum of theircapacitances. The above-described configuration obtains a very highdensity of the capacitors 205 that provides a very high totalcapacitance, for example, of the order of 500-1.000 capacitors (asabove) per cm2; at the same time, the coupling with the (whole)conductive elements (for example, with a width of 0.5-1.5 mm) is veryrobust.

With reference now to FIG. 6, an illustrative representation inperspective view is shown of the supply insert 200 according to anembodiment of the present disclosure.

In this case, the capacitors 205 are mounted directly on one or more ofthe (end) surfaces of the supply module 150 that are reached by theinsulating elements 155; for example, several capacitors 205 are mountedalong each insulating element 155 (for example, distributed uniformlyalong it) on the (hosting) front surface 150 f and on the (hosting) backsurface 150 b (only visible for the front surface 150 f in the figure).Moreover, the front supply circuit and the back supply circuit (notshown in the figure) are coupled with the conductive elements 160 at thefront surface 150 f and at the back surface 105 b by respectivethrough-vias that reach the corresponding terminals 205 a, 205 b of thecapacitors 205 (for example, plated with copper), only visible for thefront surface 150 f and denoted with the reference 615 f in the figure;e.g., the through-vias 615 f along the capacitors 205 of each insulatingelement 155 are coupled alternately with the (first) terminals 205 a andwith the (second) terminals 205 b of the capacitors 205, so as to bestaggered to each other; this avoids (or at least significantly reduces)any risk of interference among the through-vias 615 f connected to thecorresponding adjacent conductive elements 160.

As above, the capacitors 205 are connected in parallel to thecorresponding supply terminals of the chip (not shown in the figure), soas to provide a total capacitance equal to the sum of theircapacitances. The above-described configuration obtains a very highdensity of the capacitors 205, which provides a very high totalcapacitance, for example, of the order of 200-400 capacitors (as above)per cm2.

With reference now to FIG. 7A-FIG. 7D, phases are shown of a process formanufacturing the supply insert according to an embodiment of thepresent disclosure.

For the sake of simplicity, in the following reference will be made to asingle supply insert. However, in general the manufacturing is performedat the level of a batch of identical supply inserts that are formedsimultaneously in a large plate and then sawed, milled and polished.

Starting from FIG. 7A, a conductive layer 710 of the same material ofthe conductive elements of the supply module is provided (for example,with a thickness of 0.3-2.0 mm). An insulating layer 715 of the samematerial of the insulating elements of the supply insert (for example,pre-impregnated with epoxy resin) is laminated onto the conductive layer710.

Moving to FIG. 7B, the same operation is repeated as many times asrequired so as to obtain a composite panel with a sandwiched structureformed by alternated conductive layers 710 and insulating layers 715(for example, 20-40 conductive/insulating layers 710, 715 starting andending with conductive layers 710); the conductive layers 710 may havethe same thickness (as shown in the figure) or different thicknesses,combined in any way according to contingent needs. This composite panel(once turned horizontally by 90°) directly defines the supply module 150without any recess for mounting the capacitors (not shown in the figure)on its front surface and back surface, so as to obtain the supply insertof FIG. 6. For example, for this purpose the capacitors are attached tothe corresponding conductive elements by using an attaching mediaproviding both electrical and mechanical connection, such as a sinteringpaste based on copper or any other suitable alloy; the sintering paste(once sintered) maintains its properties and remains in the solid stateeven if subject to relatively high temperatures (for example, up to400-500° C.). This prevents any dangerous melting of the sintering pasteduring the next thermal cycles that are typically performed formanufacturing the electronic device. The capacitors and the sinteringpaste are then covered by a filler of electrically insulating (butpossibly thermally conductive) material, which improves the mechanicalconnections and compensate any thermal expansion mismatch.

Moving to FIG. 7C, as an alternative the composite panel is milledand/or drilled along each insulating layer 715 at its (vertical)surfaces (perpendicular to the conductive/insulating layers 710, 715).This composite panel (once turned horizontally by) 90° then defines thesupply module 150 with the channels 305 f, 305 b formed by themilling/drilling for mounting the capacitors (not shown in the figure)within them as above, so as to obtain the supply insert of FIG. 3.

Moving to FIG. 7D, as a further alternative the composite panel ismilled and/or drilled along the insulating layers 715 alternately at itsvertical surfaces. This composite panel (once turned horizontally by90°) then defines the supply module 150 with the channels 405 f, 405 bformed by the milling/drilling for mounting the capacitors (not shown inthe figure) within them as above, so as to obtain the supply insert ofFIG. 4.

With reference now to FIG. 8, phases are shown of a process formanufacturing the supply insert according to an embodiment of thepresent disclosure.

For example, the process is used to manufacture the supply insert 150 ofFIG. 5 (shown in exploded view in the figure). For this purpose, asabove a conductive layer 810 a is provided and an insulating layer 815 ais laminated onto the conductive layer 810 a. A composite panel formedby the conductive layer 810 a and the insulating layer 815 a is drilledand/or milled at a free surface of the insulating layer 815 a to formchannels 820 a that extend downwards into the conductive layer 810 a.Corresponding capacitors 205 are then mounted (in vertical) within thechannels 820 a (by only attaching their terminals 205 a to theconductive layer 810 a as above, whereas their terminals 205 b are leftfree projecting outside the channels 820 a).

Again, a conductive layer 810 b is provided and an insulating layer 815b is laminated onto the conductive layer 810 b. A composite panel formedby the conductive layer 810 b and the insulating layer 815 b is milledand/or drilled at a free surface of the conductive layer 810 b and at afree surface of the insulating layer 815 b to form channels 820 bl and820 bu, respectively that extend upwards and downwards, respectively,into the conductive layer 810 b. The composite panel 810 b, 815 b islaminated onto the composite panel 810 a, 815 a. At the same time, thecapacitors 205 already mounted within the channels 820 a are furthermounted within the channels 820 bl (by attaching their terminals 205 bto the conductive layer 810 b as above); in this way, each pair ofopposite channels 820 a and 820 bl forms the corresponding through-holehousing these capacitors 205. Further corresponding capacitors 205 arethen mounted (in vertical) within the channels 820 bu (by only attachingtheir terminals 205 a to the conductive layer 810 b as above, whereastheir terminals 205 b are left free projecting outside the channels 820bu). The same operations are repeated as many times as required.

At the end, again a conductive layer 810 c is provided. The conductivelayer 810 c is milled and/or drilled at a (lower) free surface thereofto form channels 820 c that extend upwards into the conductive layer 810c. The conductive layer 810 c is laminated onto the composite panel 810b, 815 b. At the same time, the capacitors 205 already mounted withinthe channels 820 bu are further mounted within the channels 820 c (byattaching their terminals 205 b to the conductive layer 810 c as above);in this way, each pair of opposite channels 820 bu and 820 c forms thecorresponding through-hole housing these capacitors 205. As a result,the supply insert of FIG. 5, already with the capacitors 205 mountedwithin its through-holes, is obtained (once turned horizontally by 90°).

The above-described operations may also be performed in parallel (atleast partially). For example, a pre-processed component formed by thecomposite panel 810 a, 815 a with the channels 820 a, one or morepre-processed components each one formed by the composite panel 810 b,815 b with the channels 820 b 1, 820 bu and a pre-processed componentformed by the conductive layer 810 c with the channels 820 c may beprovided, with the corresponding capacitors 205 already mounted in thechannels of a pre-processed component of each pair of adjacentpre-processed components. These pre-processed components may then belaminated in a single operation to obtain the same supply insert asabove.

Naturally, in order to satisfy local and specific requirements, a personskilled in the art may apply many logical and/or physical modificationsand alterations to the aspects of the present disclosure. Morespecifically, although aspects of this disclosure have been describedwith a certain degree of particularity with reference to one or moreembodiments thereof, it should be understood that various omissions,substitutions and changes in the form and details as well as otherembodiments are possible. For example, different embodiments of aspectsof the present disclosure may even be practiced without the specificdetails (such as the numerical values) set forth in the precedingdescription to provide a more thorough understanding thereof;conversely, well-known features may have been omitted or simplified inorder not to obscure the description with unnecessary particulars.Moreover, it is expressly intended that specific elements and/or methodsteps described in connection with any embodiment of the presentdisclosure may be incorporated in any other embodiment as a matter ofgeneral design choice. In any case, ordinal or other qualifiers aremerely used as labels to distinguish elements with the same name but donot by themselves connote any priority, precedence or order. Moreover,the terms include, comprise, have, contain and involve (and any formsthereof) should be intended with an open, non-exhaustive meaning (i.e.,not limited to the recited items), the terms based on, dependent on,according to, function of (and any forms thereof) should be intended asa non-exclusive relationship (i.e., with possible further variablesinvolved), the term a/an should be intended as one or more items (unlessexpressly indicated otherwise), and the term means for (or anymeans-plus-function formulation) should be intended as any structureadapted or configured for carrying out the relevant function.

One or more aspects of the present disclosure are based on the idea ofmounting auxiliary components on a transversal portion of a circuitizedsubstrate.

One aspect provides a circuitized substrate for mounting at least oneelectronic component, wherein one or more auxiliary components of theelectronic component are mounted on a portion of electrically conductivematerial having one or more insulating elements of electrical insulatingmaterial crossing it transversally to a plane of the circuitizedsubstrate to insulate a plurality of conductive elements thereof.

A further aspect provides a corresponding insert for use in thecircuitized substrate.

A further aspect provides an electronic device comprising thecircuitized substrate.

A further aspect provides a method for manufacturing the circuitizedsubstrate.

In one example, an embodiment provides a circuitized substrate formounting at least one electronic component having a plurality ofterminals. However, the circuitized substrate may be of any type (forexample, a PCB); the circuitized substrate may be used to mount anynumber and type of electronic components (for example, discreteelements) with any number and type of terminals (for example, pins).

In an embodiment, the circuitized substrate comprises a first portion ofelectrical insulating material. However, the first portion may be of anytype (for example, integral) and of any material (for example,thermosetting resin).

In an embodiment, the first portion embeds a first electric circuit forcoupling a first subset of the terminals. However, the first electriccircuit may be of any type (for example, with tracks, bars or anycombination thereof); the terminals of the first subset may be in anynumber, at any position (for example, arranged laterally) and of anytype (for example, for receiving the power supply as well).

In an embodiment, the first electric circuit comprises one or morepatterned conductive layers of electrically conductive materialextending parallel to a plane of the circuitized substrate. However, theconductive layers may be in any number, of any material (for example,aluminum) and with any topology (with or without through-vias).

In an embodiment, the circuitized substrate comprises a second portionof electrically conductive material. However, the second portion may beof any type (for example, formed by two or more bodies) and of anymaterial (for example, aluminum).

In an embodiment, one or more insulating elements of electricalinsulating material cross the second portion transversally to said planeto insulate a plurality of conductive elements thereof for coupling asecond subset of the terminals. However, the insulating elements may bein any number and of any material (either the same or different fromabove) and they may cross the second portion transversally in any way(for example, obliquely by forming any non-null angle with said plane,such as 80°-100°, in particular 85°-95° and more particularly 87°-93°,such as 90°) to define any number and type of conductive elements (forexample, extending along a non-linear curve); the terminals of thesecond subset may be in any number, at any position (for example,arranged laterally) and of any type (for example, for exchanging signalsin addition or in alternative to receiving the power supply).

In an embodiment, the circuitized substrate comprises one or moreauxiliary components of the electronic component mounted on the secondportion. However, the auxiliary components may be in any number and ofany type (for example, resistors, inductors, voltage regulators).

In an embodiment, each auxiliary component has a first terminal and asecond terminal coupled with a first one and a second one, respectively,of a pair of the conductive elements. However, the first and secondterminals may be of any type (for example, pins) and they may be coupledin any way (for example, glued) with any pair of conductive elements(for example, conductive elements that are not adjacent to each othersince separated by two or more conductive elements).

In an embodiment, the terminals of the first subset are signal terminalsfor exchanging signals with the electronic component and the terminalsof the second subset are supply terminals for supplying the electroniccomponent. However, the signal terminals and the supply terminals may beof any type (for example, for exchanging logic or analogic signals andfor receiving main or I/O supply voltages, respectively).

In an embodiment, the first portion comprises a plurality of insulatinglayers of electrical insulating material alternated with the conductivelayers. However, the insulating/conductive layers may be in any numberand of any size.

In an embodiment, in the second portion the conductive elements and theinsulating elements comprise further conductive layers and furtherinsulating layers, respectively, alternated to each other. However, thefurther insulating/conductive layers may be in any number and of anysize.

In an embodiment, the second portion has one or more recesses each onehousing one or more of the auxiliary components. However, the recessesmay be in any number each one for housing any number of auxiliarycomponents (totally or only in part), or they may be omitted.

In an embodiment, each recess extends along the corresponding insulatingelement within the first conductive element and the second conductiveelement of the corresponding pair. However, the recess may have anyextent (for example, only running along a part of the correspondinginsulating element).

In an embodiment, the second portion has a plurality of second endsurfaces; at least part of the recesses are channels extending in thesecond portion from at least one hosting surface of the second endsurfaces (so that in each hosting surface each pair of adjacent ones ofthe channels defines a raised portion of the hosting surface). However,the hosting surfaces may be in any number, at any position (for example,laterally) and with any number of channels (for all the recesses or onlypart thereof); in each hosting surface, the channels may be in anynumber and arranged in any way to define the corresponding raisedportions.

In an embodiment, the raised portions are free of the insulatingelements. However, the raised portions may be free of the insulatingelements in any way (for example, because covered by an additionalinsulating layer).

In an embodiment, at least one of the insulating elements extends fromeach raised portion. However, the insulating elements extending fromeach raised portion may be in any number and of any type (for example,only running along a part thereof).

In any case, any combination of raised portions with and withoutinsulating elements is possible.

In an embodiment, for each raised portion a further first one and afurther second one of the conductive elements extend from the raisedportion at opposite sides of the corresponding insulating element; thefurther first conductive element is contacted at a plurality of firstcontact positions for coupling with corresponding terminals of thesecond subset and the further second conductive element is contacted ata plurality of second contact positions for coupling with correspondingterminals of the second subset. However, the contact positions may be inany number and for any type of contact elements (for example, solderballs), either for coupling the conductive elements with thecorresponding terminals directly or through the corresponding electriccircuit.

In an embodiment, the first contact positions and the second contactpositions are staggered to each other. However, the contact positionsmay be staggered in any way (for example, only partially). In any case,the contact positions may be staggered in any other embodiment, they mayalways be aligned or they may be arranged in any combination thereof.

In an embodiment, the hosting surfaces comprise a first hosting surfaceand a second hosting surface opposite to each other. However, the pairof opposite hosting surfaces may be in any number.

In an embodiment, the raised portions of the first hosting surface andthe raised portions of the second hosting surface are staggered to eachother. However, these raised portions may be staggered in any way(either uniformly or not) or more generally they may be arranged in anyother way (always staggered, always aligned or in any combinationthereof).

In an embodiment, at least part of the recesses are holes crossing thesecond portion at least partially. However, the holes may be in anynumber (for all the recesses or only part thereof) and arranged in anyway (either uniformly or not); moreover, the holes may be of any type(for example, only through-holes, only blind holes or any combinationthereof).

In an embodiment, the second portion has a plurality of second endsurfaces; at least part of the auxiliary components are mounted on atleast a hosting surface of the second end surfaces. However, theauxiliary components may be mounted in any number on any number ofsurfaces (totally or only in part), or they may be mounted always incorresponding recesses.

In an embodiment, for each pair of first conductive element and secondconductive element extending from each hosting surface the firstterminals and the second terminals of the corresponding auxiliarycomponents are contacted alternately for coupling the first conductiveelement and second conductive element, respectively, with correspondingterminals of the second subset. However, the contacts may be in anynumber and of any type (either the same or different from above);moreover, the contacts may be alternated in any way (for example, byskipping one or more auxiliary components). In any case, the contactsmay be with the terminals of the auxiliary components (either alternatedor not) in any other embodiment, they may always be with the conductiveelements directly or they may be in any combination thereof.

In an embodiment, the first portion extends between a first end surfaceand a further first end surface parallel to said plane and it has atleast one through hole crossing the first portion from the first endsurface to the further first end surface; the second portion is insertedin the through-hole. However, the through holes (and then the secondportions) may be in any number, of any size, and at any position;moreover, the second portion may be arranged within the through hole inany way (for example, sunk in and/or protruding from the first portionat one or both of its end surfaces).

In an embodiment, the circuitized substrate comprises an externalportion of electrical insulating material covering the first end surfaceand the second portion. However, the external portion may be provided atthe first end surface only, at both the first end surface and thefurther first end surface, or it may be omitted.

In an embodiment, the external portion comprises a further firstelectric circuit for coupling the terminals of the first subset with thefirst electric circuit and a second electric circuit for coupling theterminals of the second subset with the conductive elements. However,the further first electric circuit and the second electric circuit maybe of any type (either the same or different with respect to each otherand to the first electric circuit).

In an embodiment, the further first electric circuit and the secondelectric circuit comprise one or more further patterned conductivelayers of electrical conducting material extending parallel to saidplane. However, the further conductive layers may be in any number, ofany material and with any topology (either the same or different fromabove).

In an embodiment, the auxiliary components are decoupling capacitors.However, the capacitors may be of any type (for example, small, big,narrow, large) and in any combinations.

In an embodiment, the circuitized substrate is a chip carrier and saidat least one electronic component is a monolithic chip. However, thechip carrier may be of any type (for example, for high-frequencyapplications) and the chip may be of any type (for example, implementinga flash memory).

An embodiment provides an insert for use in the above-mentionedcircuitized substrate; the insert comprises said second portion and saidauxiliary components mounted on the second portion. However, the insertmay be provided with different, additional or alternative features (forexample, with any empty spaces filled with a filler, such as epoxyresin, to consolidate it), either as a stand-alone product or alreadyembedded in the circuitized substrate.

An embodiment provides an electronic device comprising theabove-mentioned circuitized substrate and said at least one electroniccomponent mounted on the circuitized substrate. However, the electronicdevice may be of any type (for example, embedded in a plastic package,with a dual-side cooling system); the electronic device may be usedstand-alone, in intermediate products (such as motherboards) or incomplex systems (such as computers).

In an embodiment, the electronic device is of the flip-chip type.However, the electronic device may be of any type (for example, ofwire-bonding type).

Generally, similar considerations apply if the circuitized substrate,the insert and the electronic device each one has a different structureor comprises equivalent components (for example, of differentmaterials), or it has other operative characteristics. In any case,every component thereof may be separated into more elements, or two ormore components may be combined together into a single element;moreover, each component may be replicated to support the execution ofthe corresponding operations in parallel. Moreover, unless specifiedotherwise, any interaction between different components generally doesnot need to be continuous, and it may be either direct or indirectthrough one or more intermediaries.

An embodiment provides a method for manufacturing a circuitizedsubstrate for mounting at least one electronic component having aplurality of terminals, the method comprising: providing a first portionof electrical insulating material embedding a first electric circuit forcoupling a first subset of the terminals, the first electric circuitcomprising one or more patterned conductive layers of electricallyconductive material extending parallel to a plane of the circuitizedsubstrate, providing a second portion of electrically conductivematerial, one or more insulating elements of electrical insulatingmaterial crossing the second portion to insulate a plurality ofconductive elements thereof for coupling a second subset of theterminals, with one or more auxiliary components of the electroniccomponent mounted on the second portion, each auxiliary component havinga first terminal and a second terminal coupled with a first one and asecond one, respectively, of a pair of the conductive elements, andadding the second portion to the first portion to have the insulatingelements extending transversally to said plane.

However, either the whole circuitized substrate or the insert alone (forinsertion into the first portion of the circuitized substrate) may bemanufactured in any way (for example, by depositing the insulatinglayers onto the conductive layers).

Generally, similar considerations apply if the same aspect isimplemented with an equivalent method (by using similar steps with thesame functions of more steps or portions thereof, removing some stepsbeing non-essential, or adding further optional steps); moreover, thesteps may be performed in a different order, concurrently or in aninterleaved way (at least in part).

The above-described features may be combined in any way.

What is claimed is:
 1. A circuitized substrate for mounting at least oneelectronic component having a plurality of terminals, the circuitizedsubstrate comprising: a first portion of electrical insulating materialembedding a first electric circuit for coupling a first subset ofterminals, the first electric circuit comprising one or more patternedconductive layers of electrically conductive material extending parallelto a plane of the circuitized substrate; a second portion ofelectrically conductive material, wherein one or more insulatingelements of electrical insulating material cross the second portiontransversally to said plane to insulate a plurality of conductiveelements thereof for coupling a second subset of terminals; and one ormore auxiliary components of an electronic component mounted on thesecond portion, an auxiliary component having a first terminal and asecond terminal coupled with a first conductive element and a secondconductive element, respectively, of a pair of conductive elements ofthe plurality of conductive elements.
 2. The circuitized substrateaccording to claim 1, wherein the terminals of the first subset aresignal terminals for exchanging signals with the electronic componentand the terminals of the second subset are supply terminals forsupplying the electronic component.
 3. The circuitized substrateaccording to claim 1, wherein the first portion comprises a plurality ofinsulating layers of electrical insulating material alternated with theone or more patterned conductive layers, and wherein in the secondportion the plurality of conductive elements and the one or moreinsulating elements comprise further conductive layers and furtherinsulating layers, respectively, alternated to each other.
 4. Thecircuitized substrate according to claim 1, wherein the second portionhas one or more recesses, and wherein a recess houses at least oneauxiliary component of the one or more the auxiliary components, therecess extending along a corresponding insulating element within thefirst conductive element and the second conductive element of acorresponding pair of conductive elements.
 5. The circuitized substrateaccording to claim 4, wherein the second portion has a plurality ofsecond end surfaces, at least part of the one or more recesses beingchannels extending in the second portion from at least a hosting surfaceof the plurality of second end surfaces, wherein in the hosting surfacea pair of adjacent ones of the channels define a raised portion of thehosting surface.
 6. The circuitized substrate according to claim 5,wherein the raised portion is free of insulating elements.
 7. Thecircuitized substrate according to claim 5, wherein at least oneinsulating element extends from the raised portion.
 8. The circuitizedsubstrate according to claim 7, wherein for the raised portion a furtherfirst conductive element and a further second conductive element of theplurality of conductive elements extend from the raised portion atopposite sides of the corresponding insulating element, the furtherfirst conductive element being contacted at a plurality of first contactpositions for coupling with corresponding terminals of the second subsetand the further second conductive element being contacted at a pluralityof second contact positions for coupling with corresponding terminals ofthe second subset of terminals, the first contact positions and thesecond contact positions being staggered to each other.
 9. Thecircuitized substrate according to claim 5, wherein the hosting surfacecomprises a first hosting surface and a second hosting surface oppositeto each other, and wherein raised portions of the first hosting surfaceand raised portions of the second hosting surface are staggered to eachother.
 10. The circuitized substrate according to claim 4, wherein atleast part of the one or more recesses are holes crossing the secondportion at least partially.
 11. The circuitized substrate according toclaim 1, wherein the second portion has a plurality of second endsurfaces, and wherein at least part of the one or more auxiliarycomponents are mounted on at least a hosting surface of the plurality ofsecond end surfaces.
 12. The circuitized substrate according to claim11, wherein for a pair of first conductive element and second conductiveelement extending from a hosting surface, first terminals and secondterminals of corresponding auxiliary components are contactedalternately for coupling the first conductive element and the secondconductive element, respectively, with corresponding terminals of thesecond subset of terminals.
 13. The circuitized substrate according toclaim 1, wherein the first portion extends between a first end surfaceand a further first end surface parallel to said plane and has at leastone through hole crossing the first portion from the first end surfaceto the further first end surface, the second portion being inserted inthe through hole.
 14. The circuitized substrate according to claim 13,further comprising an external portion of electrical insulating materialcovering the first end surface and the second portion and comprising afurther first electric circuit for coupling the terminals of the firstsubset of terminals with the first electric circuit and a secondelectric circuit for coupling the terminals of the second subset ofterminals with the plurality of conductive elements, the further firstelectric circuit, and the second electric circuit comprising one or morefurther patterned conductive layers of electrical conducting materialextending parallel to said plane.
 15. The circuitized substrateaccording to claim 1, wherein the one or more auxiliary components aredecoupling capacitors.
 16. The circuitized substrate according to claim1, wherein the circuitized substrate is a chip carrier and the at leastone electronic component is a monolithic chip.
 17. An electronic devicecomprising: a circuitized substrate for mounting at least one electroniccomponent, the circuitized substrate comprising: a first portion ofelectrical insulating material embedding a first electric circuit forcoupling a first subset of terminals, the first electric circuitcomprising one or more patterned conductive layers of electricallyconductive material extending parallel to a plane of the circuitizedsubstrate; a second portion of electrically conductive material, whereinone or more insulating elements of electrical insulating material crossthe second portion transversally to said plane to insulate a pluralityof conductive elements thereof for coupling a second subset ofterminals; and one or more auxiliary components of an electroniccomponent mounted on the second portion, an auxiliary component having afirst terminal and a second terminal coupled with a first conductiveelement and a second conductive element, respectively, of a pair of theconductive elements of the plurality of conductive elements; and atleast one electronic component mounted on the circuitized substrate. 18.The electronic device according to claim 17, wherein the circuitizedsubstrate is a chip carrier and the at least one electronic component isa monolithic chip, and wherein the electronic device is of the flip-chiptype.
 19. A method of manufacturing a circuitized substrate for mountingat least one electronic component having a plurality of terminals, themethod comprising: providing a first portion of electrical insulatingmaterial embedding a first electric circuit for coupling a first subsetof terminals, the first electric circuit comprising one or morepatterned conductive layers of electrically conductive materialextending parallel to a plane of the circuitized substrate; providing asecond portion of electrically conductive material, wherein one or moreinsulating elements of electrical insulating material cross the secondportion to insulate a plurality of conductive elements thereof forcoupling a second subset of terminals, with one or more auxiliarycomponents of an electronic component mounted on the second portion, anauxiliary component having a first terminal and a second terminalcoupled with a first conductive element and a second conductive element,respectively, of a pair of conductive elements of the plurality ofconductive elements; and adding the second portion to the first portionto have the insulating elements extend transversally to said plane. 20.The method of claim 19, wherein the circuitized substrate is a chipcarrier and the at least one electronic component is a monolithic chip.